Announcement highlights the official launch of the company
San Jose, Calif. (August 31, 2018) — Nano Span Technologies, LLC (Nanospan), a leading provider of production inspection and metrology equipment, today announced the official launch of the company.
According to Barton Katz, President and Chief Commercial Officer of Nanospan, “Nanospan was originally contemplated as far back as 2014 amongst several industry veterans including the principals behind ASML, Neutronix Quintel (NXQ), and BrighTex Bio-Photonics (BTBP), with additional executive positions coming from companies like ThermaWave, Novellus, and Nanometrics (now Onto Innovations). Nanospan was officially formed on August 31, 2018, with the mission to deliver unique capabilities for the semiconductor manufacturing industry, completely changing how the industry approaches yield enhancement, time-to-market, and Cost of Ownership (CoO).”
Nanospan offers both macro and micro inspection and metrology products for wafer applications in R&D and HVM environments. The Nanospan product line target surface, sub-surface, and through substrate applications, with additional products under development for bump metrology, additional form factors, and substrates other silicon including silicon carbide, gallium nitride, glass, and diamond.
About Nanospan Technologies
Nanospan Technologies manufactures defect inspection and metrology equipment for customers involved in Silicon Wafer Characterization, Silicon Carbide (SiC) Ingot and Wafer Characterization, Bonded Wafer Characterization, Wafer Stress Characterization, and Glass Substrate Inspection. Nanospan Technologies was founded by industry veterans and has been designing and manufacturing semiconductor manufacturing equipment since 2018.
More Information:
For more information on Nanospan Technologies and their full line of products, please visit www.nanospantechnologies.com or contact Nanospan Technologies directly at [email protected].