High-Accuracy Micro 2D/3D Inspection & Metrology System

for wafers up to 300mm

Surface analysis and defect review tool that has the combined capabilities of a scanning electron microscope (SEM) and an atomic force microscope (AFM) in one tool. ~1 angstrom z-height detection capability to quickly characterize any surface in 3D in a matter of minutes using Photometric Stereo Technology (PST). User-focused software interface is the easiest to use of any system in the marketplace.

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  • PST increases the information available from surface reflectance variations by capturing multiple images from four lighting directions at 90-degree separation.
  • The result is high-dynamic range, single angstrom Z-resolution surface characterization capability.

Features

  • Patented angstrom-level surface imaging & characterization sequal or better in performance to AFM or SEM
  • Proprietary 2D/3D Machine Vision Algorithms and Machine Learning
  • Full Wafer Image to Microscope Image With High Magnification Objectives
  • Up to 300mm x 300mm substrates w/scanning capability
  • Imaging in all optical modalities including BF, DF, DIC, POL & FL
  • Available in Manual, Scanning * Modular configurations
  • Resolution
    • Z-height Resolution ~ 1 angstrom
    • X-Y Resolution ~ 200nm for 100X objective (objective dependent)
  • Embedded, proprietary AI engine to train defect libraries for classification and follow-on measurements
  • KLARF file input for defect review
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